Atomic Layer Deposition

CHAIRMEN

Atomic layer deposition (ALD), is well renowned for the growth of thin films with a high degree of thickness and stochiometric control. Its advantageous properties have enabled its incorporation into areas such as the semiconductor industry and renewable energy sector.

The purpose of this symposium is to provide a forum for the discussion about current research and development in the field of atomic layer deposition (ALD), encouraging discussion from fundamentals to applications. The topics will include:

 

  • Simulation, Modelling and Theory of ALD
  • Precursors and chemistry
  • Surface Functionalization
  • Structursal, chemical and electrical characterization
  • Growth and Nucleation in the Ultra-Thin Regime
  • Plasma-Enhanced ALD
  • Molecular Layer Deposition
  • Sequential infiltration synthesis
  • Area selective Deposition
  • Vapor Phase Infiltration

Congress Registration

Early Bird Payment

August 31, 2025

Abstract Submission

Abstract submission deadline

June 22, 2025

Key Dates

Abstract Submision Deadline:

June 22, 2025

Intercovamex Award Best PhD and Master´s Thesis:

August 31, 2025

Student grant application deadline:

July 4, 2025

Franscisco Mejia Lira Award:

August 31, 2025

Early Bird payment:

August 31, 2025

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